Research on IGBT Bonding Wires Crack Propagation at the Macro and Micro Scales

Under the action of a complex and harsh working environment, damage IGBT power module's packaging interconnection structure is primary failure mode. The crack propagation bonding interface bond point shedding in wires will seriously affect device's electrical function heat dissipation ability, resulting its performance degradation failure. In this work, formulation application multiscale approach combined with cohesive zone model (CZM) were proposed to investigate wires' propagation. Firstly, force model's principle considering fatigue accumulation analyzed, simulation method critical module studied. Secondly, further research on behavior carried out based macro micro scales. key package structure's defect evolution established analyze process structure. Finally, accuracy verified by experiment analysis. Such multiscale, mechanism-based offers promising for modeling understanding rate-dependent fracture wire evolution.